ELECTRONIC CLEANING

FLIP CHIPS

40mu offset, 1800 bumps, 1” x 1” package

Clean, rinse & dry in-situ,<20min. (~5 min. if optimized)

Pre-Clean Flip Chips

Post-Clean Flip Chips

This video shows the flushing of dyed paste from between clamped plates. The removal would be similar to what is required for flux removal from under bump flip chips.