ELECTRONIC CLEANING

FLIP CHIPS

40mu offset, 1800 bumps, 1” x 1” package

Clean, rinse & dry in-situ,<20min. (~5 min. if optimized)

Pre-Clean Flip Chips

Post-Clean Flip Chips

This video demonstrates the hydraulic flushing of dye-infused paste from the interface between clamped plates. The procedure resembles the removal of flux residues from beneath bump flip chips.