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AQUEOUS VCN CLEANING SYSTEMS > FLIP CHIP DE FLUXING

Flip Chip Defluxing

Flip Chip Under Bump Metallization Clean (flux removal)

  • 40mu offset, 1800 bumps, 1” x 1” package
  • Clean, rinse & dry in-situ, <20 min. (~5 min. if optimized)

pre-clean

post-clean

post-clean

click on the images for larger views



The video shows the VCN mechanism for moving fluid in and out of tight qffset areas. Fresh fluid enters at the bottom between close plates and expels spent fluid at the top of the plates.